According to Ningbo Daily, Ningbo Dayang Technology Co., Ltd. has taken the lead in drafting the "Performance Requirements for Outdoor UV LED Mosquito Repellents" standard, which is the first industry standard in China involving outdoor LED lighting mosquito control.

SIP packaging (System In a Package) is the process of packaging multiple functional wafers, including processors, memories, etc., based on application scenarios, packaging substrate layers, and other factors

After years of experience and scientific research in SMT processing plants, there is no evidence that voids in a single solder joint can cause solder joint failure. However, in many cases, voids located in the cross-section of the solder pad are a huge quality hazard

Before PCBA processing, there is a process that many PCBA manufacturers overlook, which is baking the board. Baking the PCB board can remove moisture from the PCB board and components, and after the PCB reaches a certain temperature, the soldering flux can better bond with the components and solder pads.

We should select products that meet disinfection requirements based on actual usage needs and environment. For example, dishwashers mostly use high-temperature disinfection, and alcohol can disinfect some superficial wounds

In PCBA processing, the two common soldering methods are reflow soldering and wave soldering. So what is the role of reflow soldering and wave soldering in circuit board processing, and what are their differences?

SMT, short for Surface Mount Technology, is currently the most popular technology and process in the electronic assembly industry, and almost all electronic products cannot do without SMT technology.

PCB (Printed Circuit Board) is the support body for electronic components and the carrier for electronic component electrical connections.